Home News News News

Semiconductor Packaging Industry Research Report


   With the development of semiconductor technology, Moore's Law is near the edge of failure. IC chain on the industrial chain, wafer manufacturing, packaging and testing the various aspects of the increasing difficulty, the technical threshold is also getting higher and higher, capital investment is growing. By a single enterprise covering the entire industry chain technology significantly increased the difficulty. Semiconductor industry chain to the professional, fine division of labor development is an inevitable trend.
         The overall growth of the global semiconductor industry slowed down, the industrial structure adjustment, production capacity in the region to re-distribution. Semiconductor industry developed areas and underdeveloped areas will be based on their own advantages in the semiconductor industry chain have different focus on the development. Packaging capacity transfer will continue, outsourcing packaging and testing industry growth is expected to go beyond the industry.
         Chip design industry technical barriers and wafer manufacturing industry financial barriers to decide, at this stage, the packaging and testing industry will be the focus of China's semiconductor industry development.
         In the traditional packaging process, the highest cost of gold. The current use of copper wire instead of gold is a big trend. The increase in the proportion of chip products shipped with copper wire leads to increased profitability of packaged enterprises.
         The development of semiconductor packaging in the direction of miniaturization and multi-I / O trend. Specific technical developments include multi-I / O pin-packaged BGA and small-footprint CSPs. WLSCP and TSV and other new technologies is expected to promote the chip packaging test to bring revolutionary progress.

All rights reserved:苏州建道电子有限公司

备案号: 苏ICP备17032532号-1

TEL:+0512-69165455    Email:www.wanhu.com.cn

Add:Room 727, Su Shangxin, 555 Guantang Road, Suzhou City, Suzhou, China

Website main products:Transistor Transistor SOT-23-6 Package SOP-8 Package Low Voltage MOS High Voltage MOS Integrated Circuit Memory IC

Electronic application
Semiconductor sealing
EP system
EP system
Semiconductor sealing
Thermal silicone rubber
Silicone oil
Silicone resin
Silane coupling
RTV silicone
Silicone powder
Paint additives
Heat shrink tube
Industry news
Company News
service & support
Sales network
After-sales service
About Us
Company Profile
Company culture
Contact Us
Contact Us