CZ, MCZ, FZ。
Prime, Test, Dummy, etc。
12 inch/300mm。
600~800um。
As cut, lapped, DSP(300nm, 200nm,120nm, 90nm,65nm, 37nm), etc
(100) etc。
upto4deg
P/B, N/Phos, N/As, N/Sb, Intrinsic。
CZ/MCZ: From 0.001 to 200 ohm-cm。FZ : up to 5000 ohm-cm。
(a)PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo. etc, Coating thicknesses up to 20.000A/土5 %
(b)LPCVD/PECVD: Oxide, Nitride, siC, etc，Coating thicknesses up to 200.000A/土3%
(c)Silicon epitaxial wafers and epitaxial services(SOS, GaN, GOI etc)，
a.定制双抛、超薄、超平硅片/ DSP, ultra thin, ultra flat, etc。
b.掏圆、减薄、切割/ Downsizing, back grinding, dicing，etc。
c.微纳加工/MEMS。
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